ZEISS Xradia 520 Versa, X-ray Microscope for Submicron X-ray Imaging


With ZEISS Xradia 520 Versa you extend the limits of your exploration. Unlock versatility for your scientific discovery and industrial research with ZEISS Xradia 520 Versa, the most advanced model in the Xradia Versa family. Image non-destructively in 3D with X-rays. Build on industry-best resolution and contrast. Expand the boundaries of non-destructive imaging. Innovative contrast and acquisition techniques free you to seek - and find – what you’ve never seen before.



Resolution Beyond Micro-CT

A defective TSV (through-silicon-via, a high performance interconnection in a silicon wafer)

Explore a multitude of lab-based applications, sample types and sizes with ZEISS Xradia 520 Versa. Benefit from extending your research beyond the limits of basic projection-based micro-and nano-CT systems. Achieve images with a spatial resolution of 0.7 µm and minimum achievable voxel of 70 nm.

The Technology Behind X-ray Optics


Discover the magnification concept

Profit from achieving submicron resolution at large working distances, known as Resolution at a Distance (RaaD). Xradia Versa architecture natively uses a two-stage magnification: images are initially enlarged through geometric magnification as they are in conventional micro-CTs. The projected image impinges on a scintillator, which converts X-rays to visible light. Your image is subsequently magnified by an optical objective before reaching the detector. Add the optional flat panel extension (FPX) to your system to further increase its versatility. This combination of detector designs allows you to study a wide range of sample sizes and types efficiently and accurately.


Optimize contrast for maximum discernibility

Dual Scan Contrast Visualizer (DSCoVer)

With DSCoVer you take advantage of how X-rays interact with matter based on effective atomic number and density. Probe for features normally indistinguishable in a single scan. Identify, for example, mineralogical differences within rocks and difficult-to-discern materials such as silicon and aluminum. Profit from side-by-side tuning of two distinct tomographies at different imaging and sample conditions. Collect data for dual energy analysis seamlessly and easily with DSCoVer.  


Gain better image quality in less scan time

High-Aspect Ratio Tomography (HART)

Achieve up to 2x higher throughput or better image quality when imaging flat samples such as semiconductor packages and boards. HART enables you to space variable projections so that you collect fewer projections along the broad side of a flat sample and more along the thin side. 3D data is provided by these closely-spaced long views versus less densely-spaced short views.

The Automated Filter Changer offers 12 standard filters

Automated Filter Changer (AFC)

Image challenging samples even easier now. Use AFC to complement your DSCoVer and profit from more flexibility for your in situ workflows. Tune your X-ray energy spectrum with source filters enabled by AFC that houses a standard range of 12 filters along with space for a dozen additional custom filters for new applications. Select filters easily and record your selection within imaging recipes so filters may be changed without disrupting your work flow.


Flexibly Image Larger Samples

Wide Field Mode (WFM) & Vertical Stitching

Image large samples with an extended lateral field of view or use the standard field of view to achieve higher resolution in a single tomography with the help of WFM. Profit from a bigger lateral field of view: approximately twice as wide as in the standard mode and three times larger for a 3D volume. Using the standard field of view, WFM provides nearly twice the number of voxels. Combine WFM with the existing Vertical Stitching feature and subsequently image large samples that are both wider and taller than the standard field of view usually allows.